作者列出多个电子元器件供应链瓶颈的时间线——ABF载板（1年）、HDI板（超过6个月）、多层板（约6个月）、CCL（超过6个月）、电容/电阻（15-20周到1年以上），并列举相关公
作者列出多个电子元器件供应链瓶颈的时间线——ABF载板（1年）、HDI板（超过6个月）、多层板（约6个月）、CCL（超过6个月）、电容/电阻（15-20周到1年以上），并列举相关公司。未给出具体股票建议。
“Some updates on bottleneck timelines: - ABF substrates: 1 year / eg. Ajinomoto (2802) for ABF film, Ibiden, Unimicron, Nan Ya PCB, etc make the substrates - HDI Boards: Over 6 months / Victory Giant (300476), Zhen Ding (4958), Unimicron, Compeq (2313), Meiko (6787) - Multilayer boards: ~6 months / Victory Giant, WUS (002463), $TTMI, Gold Circuit Electronics (2368), - CCL: Over 6 months (severe shortages of materials) / Elite Material (2383), Shengyi (600183), TUC (6274), ITEQ (6213), Nan Ya Plastics (1303), Resonac (4004) Mitsui Kinzoku (5706) / HVLP copper foil. Nittobo / glass fiber/cloth - MLCCs, chip resistors, tantalum capacitors, aluminum electrolytic capacitors: 15-20 weeks to 1 year+ MLCC: Murata (6981), Samsung Electro-Mechanics, TDK (6762), Taiyo Yuden (6976), Yageo (2327), Walsin (2492) Chip Resistors: Yageo, Walsin, KOA (6999), Rohm (6963) and $VSH Tantalum capacitors: Kyocera/AVX, Yageo/KEMET, $VSH again Aluminum electrolytic capacitors: Nippon Chemi-Con (6997) Nichicon (6996) | Timelines sourced from Digitimes, did the honors of adding in related companies. But it's slightly more nuanced since MLCCs and others mix. in commodity types vs. AI DCs. Regardless, just some helpful mapping.”原帖：X / @aleabitoreddit ↗