The author highlights LPKF's claim that 80% of major global players have selected its equi
The author highlights LPKF's claim that 80% of major global players have selected its equipment for glass substrates, which the author sees as a clear indicator that glass substrates are the next packaging shift. The author expects the market to price this in as volume ramps, citing estimated timelines for Absolics (H2 2026), Samsung Electro Mechanics (2027), and TSMC CoPoS (2028), with possible LPKF upstream exposure.
“I mean... if i had to guess, $LPK did claim "80% of customers among major global players have selected LPKF equipment". Kinda clear glass substrates is the next packaging shift! From est. timelines, major players like Absolics is ramping H2 2026, Samsung Electro Mechanics 2027 + their partners. Then there's major shifts like TSM CoPoS 2028 (seems possible $LPK upstream exposure, unconfirmed). Just that claim of 80% is staggering and my personal expectation was markets might price it in eventually as they volume ramp (disclosure, own LPK). Don't think there needs to be any major news, probably just getting closer to HVM timelines.”Original post：X / @aleabitoreddit ↗