作者强调LPKF声称80%的主要全球玩家选择了其玻璃基板设备，认为这清楚表明玻璃基板是下一个封装转变。作者预计随着产量提升，市场最终会消化这一信息，并引用了Absolics（202
作者强调LPKF声称80%的主要全球玩家选择了其玻璃基板设备，认为这清楚表明玻璃基板是下一个封装转变。作者预计随着产量提升，市场最终会消化这一信息，并引用了Absolics（2026年下半年）、三星电机（2027年）和台积电CoPoS（2028年）的预计时间线，以及LPKF可能的上游暴露。
“I mean... if i had to guess, $LPK did claim "80% of customers among major global players have selected LPKF equipment". Kinda clear glass substrates is the next packaging shift! From est. timelines, major players like Absolics is ramping H2 2026, Samsung Electro Mechanics 2027 + their partners. Then there's major shifts like TSM CoPoS 2028 (seems possible $LPK upstream exposure, unconfirmed). Just that claim of 80% is staggering and my personal expectation was markets might price it in eventually as they volume ramp (disclosure, own LPK). Don't think there needs to be any major news, probably just getting closer to HVM timelines.”原帖：X / @aleabitoreddit ↗