作者指出,欣興電子(3374)作為台積電封裝/測試子公司,因台積電COUPE量產於2026年下半年啟動及積極追求CPO機會而具投機價值。他們認為垂直整合帶來不對稱上漲潛力,並提及板
作者指出,欣興電子(3374)作為台積電封裝/測試子公司,因台積電COUPE量產於2026年下半年啟動及積極追求CPO機會而具投機價值。他們認為垂直整合帶來不對稱上漲潛力,並提及板塊重新定價。披露:持有上述所有股票。
“Xintec (3374) also looks like an interesting idea (TSMC packaging/test subsidary). MC is at ~ $2.18B. $TSM COUPE mass production starts this half, H2 2026. and... they have plans for "Aggressively pursuing CPO opportunities with subsidiaries Xintec". This is just very high-level, not too much public figures on volumes flowing to Xintec in COUPE. But this is just a asymmetrical guess on $TSM wanting to vertically integrate as much as possible and volume flowing down to their own subidary. Lot of the Taiwan CPO stocks like Foci, MSSCorp, Shunsin (foxconn advanced packaging/test), and co. are gradually being repriced... (disclosure: have exposure to everything above). But generally, architectural shift is going to be pretty sudden, and will show up in their balance sheets soon. Especially $TSM related companies (Xintec looks more compelling than VisEra, at least for this next few months). Foci I've already covered for FAU.”原帖:X / @aleabitoreddit ↗